LEI Record ISSUED 984500DBA0DD054VZA65

JAP BUILDCON PRIVATE LIMITED

Policy Conforming

Record as of 2026-10-26

LEI Record Details

  • Entity name

    JAP BUILDCON PRIVATE LIMITED

  • Registered At

    Companies Register (Ministry of Corporate Affairs)
    India
    RA000394

  • Registered As

    U45400DL2014PTC272794

  • Jurisdiction Of Formation

  • Entity Legal Form

    Private Limited Company (EN)
    YSP9

  • Entity Status

    ACTIVE

  • Legal Address

    A2A/263, GROUND FLOOR JANAK PURI, 110058, New Delhi, IN

  • Headquarters Address

    A2A/263, GROUND FLOOR JANAK PURI, 110058, New Delhi, IN
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Registration Details

  • Registration Date

    2022-01-24

  • LEI Issuer

    529900F6BNUR3RJ2WH29

  • Last Update

    2026-02-25

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000394

  • Next Renewal

    2027-04-10T17:36:21Z

  • Data Validated As

    U45400DL2014PTC272794

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