LEI Record ISSUED 984500414863FFF5EB86

NEW GRID BUILDCON LLP

Policy Conforming

Record as of 2026-10-27

LEI Record Details

  • Entity name

    NEW GRID BUILDCON LLP

  • Registered At

    Companies Register (Ministry of Corporate Affairs)
    India
    RA000394

  • Registered As

    AAC-7846

  • Jurisdiction Of Formation

    IN-MH

  • Entity Legal Form

    Limited Liability Partnership (EN)
    U5S6

  • Entity Status

    ACTIVE

  • Legal Address

    TEMP, 6th ROAD VILLAGE BANDRA,NEAR SOLITAIRE BUILDING, CTS 1407, ALMEIDA PARK, BANDRA (WEST), 400050, MUMBAI, IN-MH, IN

  • Headquarters Address

    TEMP, 6th ROAD VILLAGE BANDRA,NEAR SOLITAIRE BUILDING, CTS 1407, ALMEIDA PARK, BANDRA (WEST), 400050, MUMBAI, IN-MH, IN
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Registration Details

  • Registration Date

    2024-09-09

  • LEI Issuer

    529900T8BM49AURSDO55

  • Last Update

    2026-07-13

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000394

  • Next Renewal

    2027-09-09T12:13:31Z

  • Data Validated As

    AAC-7846

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