LEI Record ISSUED 894500E292LJ6EY5BN53

RCMPA POLISHING TECHNOLOGIES PRIVATE LIMITED

Policy Conforming

Record as of 2026-11-12

LEI Record Details

  • Entity name

    RCMPA POLISHING TECHNOLOGIES PRIVATE LIMITED

  • Registered At

    Companies Register (Ministry of Corporate Affairs)
    India
    RA000394

  • Registered As

    U24242MH2005PTC151748

  • Jurisdiction Of Formation

  • Entity Legal Form

    Private Limited Company (EN)
    YSP9

  • Entity Status

    ACTIVE

  • Legal Address

    B-15, MIDC AREA, 421503, Badlapur, IN

  • Headquarters Address

    B-15, MIDC AREA, 421503, Badlapur, IN
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Registration Details

  • Registration Date

    2021-09-08

  • LEI Issuer

    529900F6BNUR3RJ2WH29

  • Last Update

    2026-02-10

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000394

  • Next Renewal

    2027-02-10T12:29:17Z

  • Data Validated As

    U24242MH2005PTC151748

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