"冠功精密技术（厦门）有限公司"

LEI Record Details

Entity name
冠功精密技术（厦门）有限公司
Registered At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统 (国家市场监督管理总局)
China
RA000092
Registered As
91350200612040433B
Jurisdiction Of Formation
CN-FJ
Entity Legal Form
企业 (ZH)
ECAK
Entity Status
ACTIVE
Legal Address
厦门火炬高新区（翔安产业区）翔岳路63号101单元, 361101, 厦门市, CN-FJ, CN
Headquarters Address
厦门火炬高新区（翔安产业区）翔岳路63号101单元, 361101, 厦门市, CN-FJ, CN

Oops! This LEI is Lapsed. An LEI should never be 'Lapsed'. If the entity is no longer trading then the LEI should be marked as 'Retired'. Maintaining an active LEI is widely recommended. Having a Lapsed LEI can also cause complications if the regulator or financial intermediary requires the LEI to be active. A Lapsed LEI can incur penalties such as blocked or delayed trades.

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Registration Details

Registration Date
2021-12-08
LEI Issuer
655600IJ8LS3CCDA4421
Last Update
2022-03-01
Corroboration Level
FULLY_CORROBORATED
Status
LAPSED
Data Validated At
RA000092
Next Renewal
2022-12-08T06:49:49Z
Data Validated As
91350200612040433B

冠功精密技术（厦门）有限公司

LEI Record Details

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Registration Details