"交银金融科技有限公司" - LEI 836800AS6AS74JE47S17

LEI Record Details

Entity name
交银金融科技有限公司
Other names
BOCOM Financial Technology Co.,Ltd.
Registered At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统 (国家市场监督管理总局)
China
RA000092
Registered As
91310000MA1H37L463
Jurisdiction Of Formation
CN-SH
Entity Legal Form
企业 (ZH)
ECAK
Entity Status
ACTIVE
Legal Address
环湖西二路888号A楼5117室, 200120, 浦东新区, CN-SH, CN
Headquarters Address
陆家嘴环路333号, 200120, 浦东新区, CN-SH, CN

Oops! This LEI is Lapsed. An LEI should never be 'Lapsed'. If the entity is no longer trading then the LEI should be marked as 'Retired'. Maintaining an active LEI is widely recommended. Having a Lapsed LEI can also cause complications if the regulator or financial intermediary requires the LEI to be active. A Lapsed LEI can incur penalties such as blocked or delayed trades.

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Registration Details

Registration Date
2023-11-01
LEI Issuer
655600IJ8LS3CCDA4421
Last Update
2025-12-11
Corroboration Level
FULLY_CORROBORATED
Status
LAPSED
Data Validated At
RA000092
Next Renewal
2025-12-11T01:11:55Z
Data Validated As
91310000MA1H37L463

交银金融科技有限公司

LEI Record Details

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Registration Details