"苏州永辉高分子材料科技有限公司"

LEI Record Details

Entity name
苏州永辉高分子材料科技有限公司
Registered At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统 (国家市场监督管理总局)
China
RA000092
Registered As
913205856649488067
Jurisdiction Of Formation
CN-BJ
Entity Legal Form
企业 (ZH)
ECAK
Entity Status
ACTIVE
Legal Address
江苏省太仓市上海东路1号国信大厦15楼, 215400, 东城区, CN-BJ, CN
Headquarters Address
江苏省太仓市上海东路1号国信大厦15楼, 215400, 东城区, CN-BJ, CN

Oops! This LEI is Lapsed. An LEI should never be 'Lapsed'. If the entity is no longer trading then the LEI should be marked as 'Retired'. Maintaining an active LEI is widely recommended. Having a Lapsed LEI can also cause complications if the regulator or financial intermediary requires the LEI to be active. A Lapsed LEI can incur penalties such as blocked or delayed trades.

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Registration Details

Registration Date
2022-09-01
LEI Issuer
655600IJ8LS3CCDA4421
Last Update
2022-09-01
Corroboration Level
FULLY_CORROBORATED
Status
LAPSED
Data Validated At
RA000092
Next Renewal
2023-09-01T06:44:30Z
Data Validated As
913205856649488067

苏州永辉高分子材料科技有限公司

LEI Record Details

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Registration Details