LEI Record ISSUED 743700VVFFPL19FFO210

MolTech Oy

Policy Conforming

Record as of 2026-11-01

LEI Record Details

  • Entity name

    MolTech Oy

  • Other names

    Lan Connect Oy

  • Registered At

    The Business Information System (BIS) (Finnish Patent and Registration Office)
    Yritys- ja yhteisötietojärjestelmä (YTJ) (Patentti- ja Rekisterihallitus)
    Finland
    RA000188

  • Registered As

    0821049-1

  • Jurisdiction Of Formation

  • Entity Legal Form

    Osakeyhtiö (FI)
    Aktiebolag (SV)
    DKUW

  • Entity Status

    ACTIVE

  • Legal Address

    Kalkkikiventie 1, 04300 TUUSULA, FI-04300, TUUSULA, FI

  • Headquarters Address

    Kalkkikiventie 1, 04300 TUUSULA, FI-04300, TUUSULA, FI
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Registration Details

  • Registration Date

    2019-11-05

  • LEI Issuer

    743700OO8O2N3TQKJC81

  • Last Update

    2025-11-06

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000188

  • Next Renewal

    2026-11-06T10:00:00Z

  • Data Validated As

    0821049-1

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