LEI Record ISSUED 743700A14F6KLZ0WJ708

Suomen Lamina Oy

Policy Conforming

Record as of 2026-10-18

LEI Record Details

  • Entity name

    Suomen Lamina Oy

  • Registered At

    The Business Information System (BIS) (Finnish Patent and Registration Office)
    Yritys- ja yhteisötietojärjestelmä (YTJ) (Patentti- ja Rekisterihallitus)
    Finland
    RA000188

  • Registered As

    2773177-8

  • Jurisdiction Of Formation

  • Entity Legal Form

    Osakeyhtiö (FI)
    Aktiebolag (SV)
    DKUW

  • Entity Status

    ACTIVE

  • Legal Address

    Massunkuja 3 A 18, 33100 TAMPERE, FI-33100, TAMPERE, FI

  • Headquarters Address

    Massunkuja 3 A 18, 33100 TAMPERE, FI-33100, TAMPERE, FI
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Registration Details

  • Registration Date

    2022-03-20

  • LEI Issuer

    743700OO8O2N3TQKJC81

  • Last Update

    2026-03-21

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000188

  • Next Renewal

    2027-03-21T10:00:00Z

  • Data Validated As

    2773177-8

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