LEI Record ISSUED 7437005DEM4ZT3YRAW34

Spondy Oy

Policy Conforming

Record as of 2026-11-02

LEI Record Details

  • Entity name

    Spondy Oy

  • Registered At

    The Business Information System (BIS) (Finnish Patent and Registration Office)
    Yritys- ja yhteisötietojärjestelmä (YTJ) (Patentti- ja Rekisterihallitus)
    Finland
    RA000188

  • Registered As

    2163402-9

  • Jurisdiction Of Formation

  • Entity Legal Form

    Osakeyhtiö (FI)
    Aktiebolag (SV)
    DKUW

  • Entity Status

    ACTIVE

  • Legal Address

    Mesikämmenentie 15, 90450 KEMPELE, FI-90450, KEMPELE, FI

  • Headquarters Address

    Mesikämmenentie 15, 90450 KEMPELE, FI-90450, KEMPELE, FI
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Registration Details

  • Registration Date

    2021-10-27

  • LEI Issuer

    743700OO8O2N3TQKJC81

  • Last Update

    2026-10-28

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000188

  • Next Renewal

    2027-10-28T09:00:00Z

  • Data Validated As

    2163402-9

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