LEI Record ISSUED 6488T4WSQ6K6E266A976

PALIKA INFRATECH LLP

Policy Conforming

Record as of 2026-11-13

LEI Record Details

  • Entity name

    PALIKA INFRATECH LLP

  • Registered At

    Companies Register (Ministry of Corporate Affairs)
    India
    RA000394

  • Registered As

    AAH-6468

  • Jurisdiction Of Formation

  • Entity Legal Form

    Limited Liability Partnership (EN)
    U5S6

  • Entity Status

    ACTIVE

  • Legal Address

    BLOCK Q, MONDEAL BUSINESS PARK-2, NR. GURUDWARA S.G. HIGHWAY, BODAKDEV, Gujarat, 380054, Ahmedabad, IN

  • Headquarters Address

    BLOCK Q, MONDEAL BUSINESS PARK-2, NR. GURUDWARA S.G. HIGHWAY, BODAKDEV, Gujarat, 380054, Ahmedabad, IN
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Registration Details

  • Registration Date

    2025-12-17

  • LEI Issuer

    485100001PLJJ09NZT59

  • Last Update

    2026-10-21

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000394

  • Next Renewal

    2027-12-16T00:00:00Z

  • Data Validated As

    AAH-6468

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