LEI Record ISSUED 335800WMWKEYRZBSQS25

EMBASSY BUILDCON LLP

Policy Conforming

Record as of 2026-11-09

LEI Record Details

  • Entity name

    EMBASSY BUILDCON LLP

  • Registered At

    Companies Register (Ministry of Corporate Affairs)
    India
    RA000394

  • Registered As

    AAG-2031

  • Jurisdiction Of Formation

  • Entity Legal Form

    Limited Liability Partnership (EN)
    U5S6

  • Entity Status

    ACTIVE

  • Legal Address

    I FLOOR, EMBASSY POINT,, 560001, BANGALORE, IN

  • Headquarters Address

    I FLOOR, EMBASSY POINT,, 560001, BANGALORE, IN
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Registration Details

  • Registration Date

    2024-05-17

  • LEI Issuer

    529900F6BNUR3RJ2WH29

  • Last Update

    2026-06-11

  • Corroboration Level

    FULLY_CORROBORATED

  • Status

    ISSUED

  • Data Validated At

    RA000394

  • Next Renewal

    2027-06-11T10:46:05Z

  • Data Validated As

    AAG-2031

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