LEI Record ISSUED 3358006M9UGX1DVTQK06
3D TECHNOPACK PRIVATE LIMITED
Policy Non-Conforming
LEI Record Details
-
Entity name
3D TECHNOPACK PRIVATE LIMITED -
Registered At
Companies Register (Ministry of Corporate Affairs)
India
RA000394 -
Registered As
U29100MH1986PTC040844 -
Jurisdiction Of Formation
IN-MH -
Entity Legal Form
Private Limited Company (EN)
YSP9 -
Entity Status
ACTIVE -
Legal Address
809, 8TH FLOOR, LODHA SUPREMUS, I THINK TECHNO CAMPUS, SUPREMUS III, KANJURMARG (EAST),, MUMBAI CITY, 400042, MUMBAI, IN-MH, IN -
Headquarters Address
809, 8TH FLOOR, LODHA SUPREMUS, I THINK TECHNO CAMPUS, SUPREMUS III, KANJURMARG (EAST),, MUMBAI CITY, 400042, MUMBAI, IN-MH, IN
- Guarantees your existence as a registered entity
- Replaces traditional Certificates of Registration
- International business 'passport'
- Instant credibility boost
- Global Identity
- Compliance requirements simplified
Registration Details
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Registration Date
2019-04-03 -
LEI Issuer
335800FVH4MOKZS9VH40 -
Last Update
2026-03-20 -
Corroboration Level
FULLY_CORROBORATED -
Status
ISSUED -
Data Validated At
RA000394 -
Next Renewal
2027-04-08T18:30:00Z -
Data Validated As
U29100MH1986PTC040844