"双峰县科技工业园开发有限公司"

LEI Record Details

Entity name
双峰县科技工业园开发有限公司
Registered At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统 (国家市场监督管理总局)
China
RA000092
Registered As
914313217389760696
Jurisdiction Of Formation
CN-HN
Entity Legal Form
企业 (ZH)
ECAK
Entity Status
ACTIVE
Legal Address
湖南省娄底市双峰县永丰镇经济开发区万宜路(湖南双峰经济开发区管委会内), 100000, 娄底市, CN-HN, CN
Headquarters Address
湖南省娄底市双峰县永丰镇经济开发区万宜路(湖南双峰经济开发区管委会内), 100000, 娄底市, CN-HN, CN

Oops! This LEI is Lapsed. An LEI should never be 'Lapsed'. If the entity is no longer trading then the LEI should be marked as 'Retired'. Maintaining an active LEI is widely recommended. Having a Lapsed LEI can also cause complications if the regulator or financial intermediary requires the LEI to be active. A Lapsed LEI can incur penalties such as blocked or delayed trades.

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Registration Details

Registration Date
2020-05-12
LEI Issuer
655600IJ8LS3CCDA4421
Last Update
2022-12-27
Corroboration Level
FULLY_CORROBORATED
Status
LAPSED
Data Validated At
RA000092
Next Renewal
2023-12-27T04:03:38Z
Data Validated As
914313217389760696

双峰县科技工业园开发有限公司

LEI Record Details

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Registration Details