LEI Record ISSUED 2549006PS4HO89LDM372
BOCHK All Weather Asian High Yield Bond Fund
Policy Conforming
LEI Record Details
-
Entity name
BOCHK All Weather Asian High Yield Bond Fund -
Registered At
Securities and Futures Commission
Securities and Futures Commission
Hong Kong
RA000390 -
Registered As
BPG265 -
Jurisdiction Of Formation
-
Entity Legal Form
Sub-Fund -
Entity Status
ACTIVE -
Legal Address
Suite 1507, 15/F 1111 King's Road, Taikoo Shing, 999077, Hong Kong, HK -
Headquarters Address
C/O BOCHK Asset Management Limited, 40/F Bank of China Tower, 1 Garden Road, Central, 999077, Hong Kong, HK
- Guarantees your existence as a registered entity
- Replaces traditional Certificates of Registration
- International business 'passport'
- Instant credibility boost
- Global Identity
- Compliance requirements simplified
Registration Details
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Registration Date
2020-05-22 -
LEI Issuer
5493001KJTIIGC8Y1R12 -
Last Update
2025-11-10 -
Corroboration Level
FULLY_CORROBORATED -
Status
ISSUED -
Data Validated At
RA000390 -
Next Renewal
2026-11-10T18:00:47Z -
Data Validated As
BPG265