LEI Record ISSUED 2138008DFKJFMPCBUE43
HSBC ASIA HIGH INCOME BOND FUND
Policy Conforming
LEI Record Details
-
Entity name
HSBC ASIA HIGH INCOME BOND FUND -
Registered At
Securities and Futures Commission
Securities and Futures Commission
Hong Kong
RA000390 -
Registered As
BIM280 -
Jurisdiction Of Formation
-
Entity Legal Form
SUB-FUND -
Entity Status
ACTIVE -
Legal Address
C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, , CENTRAL, HK -
Headquarters Address
C/O HSBC INVESTMENT FUNDS (HONG KONG) LIMITED, HSBC MAIN BUILDING, 1 QUEEN’S ROAD, , CENTRAL, HK
- Guarantees your existence as a registered entity
- Replaces traditional Certificates of Registration
- International business 'passport'
- Instant credibility boost
- Global Identity
- Compliance requirements simplified
Registration Details
-
Registration Date
2016-12-06 -
LEI Issuer
213800WAVVOPS85N2205 -
Last Update
2025-10-27 -
Corroboration Level
FULLY_CORROBORATED -
Status
ISSUED -
Data Validated At
RA000390 -
Next Renewal
2026-12-16T00:00:00Z -
Data Validated As
BIM280